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Temperature Profile in Reflow Soldering and Influence of Different PCBś and ComponentsThermal Capacities
Procházka, Martin ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This thesis mainly deals with the prediction of temperature on the components and the PCB during reflow soldering. The theoretical part describes the particular solder reflow process, types of heat transfer and temperature profiles. The practical part is divided into forecasting temperatures if the conveyor is stopped and the temperature predictions when the conveyor is in motion. In both parts of the measured temperature is compared with the predicted temperatures, which show the success rate of prediction. The last part of this work is part of the simulation, which helps in proper understanding of the issues discussed.
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Temperature Profiles Measurement of SMD Packages
Strapko, Jaroslav ; Szendiuch, Ivan (referee) ; Starý, Jiří (advisor)
Diploma thesis mainly deals with temperature management and calculation of temperature profile in oven by using SMD packages (PLCC, 1206) of different thermal capacitance on testing PCB. Above all shows theoretical consecution of temperature profile calculation in oven by using known mathematical method like the lumped capacitance method or finite difference method. Theoretical solution and measured values are compared. Diploma thesis also deals with fixation methods of thermocouples K type on assembly, comparison methods based on known and subexperiment, determines the deficiencies of methods. This thesis can perform as theoretical as well as experimental resource to prediction of temperature profiles of PCB´s with different assembly density.
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Optimization of fabrication technology and defect detection for ceramics structures
Chyťa, Filip ; Otáhal, Alexandr (referee) ; Skácel, Josef (advisor)
This work deals with the problems of defects in ceramics structures and packages, their detection and subsequent optimization of the manufacturing process in order to eliminate these defects. The first chapter summarizes ceramic materials in elec-trical engineering and deals specifically with Al2O3 and material GRANNALOX 9620 F and optimization of its production profile. The second chapter deals with preparation of the ceramic powder and its subsequent processing. The third chap-ter deals with detection of defects in the thus formed ceramic packages, testing their electrical, thermal and mechanical makings. In the next chapter I deal with my workflow, which I used in the production of packages, the way of production and testing of packages, including comparison of their makings.
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QFN Packages Soldering and Technology Procedures
Jakub, Miroslav ; Brno, Petr Martinec, HONEYWELL (referee) ; Starý, Jiří (advisor)
This master´s thesis deals with QFN packages soldering and technology procedures optimization. The aim of theoretical part is description of QFN packages, their assembly and reflow soldering on PCB in HONEYWELL. The aim of the practical part is to propose a method of measuring temperature and optimizing the thermal profiles of selected PCB with QFN packages by using convection (HONEYWELL) and infrared (BUT) reflow ovens. Comparison and evaluation of thermal profiles for 3 production PCBś with QFN packages using solder paste AIM NC257-2 were realised. The main part of master´s thesis are appearance evaluation of solder joints, preparing microsection and measuring intermetallic layers thickness by using the optical and the scanning electron microscopes, analysation and study of QFN defects created during soldering proces. These tests were performed with 2 production PCB´s. Optimization of SPI and soldering technology procedures where were analyzed QFN packages were processed on one type of PCB. Interesting part of this diplomma thesis is creating of the 3D heat transfer model of QFN package during the reflow soldering in SolidWorks.
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Types of packaging and their representation in municipal waste
Kostková, Kateřina ; Kropáč, Jiří (referee) ; Pavlas, Martin (advisor)
The bachelor thesis deals with the types of packaging materials, related legislation and the use of packaging in practice. The research part of the work presents individual types of materials and their characteristics. An important part of waste treatment is the recycling and utilization of packaging waste. The work presents different recycling principles for individual materials. The practical part analyzes the individual representation of packaging materials of selected consumer products.
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Optimizing of QFN Package Assembly Process
Šváb, Martin ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
The Master thesis deals with technology of mounting QFN packages on to the printed circuits boards. Describes also influence of shape and size of soldering pads and the amount of soldering paste with respect to the quality and the reliability. In first part overview of existing packages is summarised. Second part describes design of testing board and the factors which leads to eliminating errors during manufacturing process.
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Design of a fluidizing device for encapsulation
Lizúch, Ján ; Skácel, Josef (referee) ; Otáhal, Alexandr (advisor)
The aim of a bachelor´s thesis is to design and construct a model of fluidized bed for encapsulating a hybrid integrated circuits. A theory about hybrid integrated circuits, their packages, principles of fluidized bed and about organic materials suitable for fluidization is included in a first part of the thesis. Next parts of the thesis discusses a design of a theoretical model and its practical construction part. Thesis also contains a part about fluidization process optimalization for a specific encapsulating material.
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Waste Economy Management in the Company
Mlejnek, Tomáš ; Zapletalová, Zuzana (referee) ; Kocmanová, Alena (advisor)
This thesis analyze the current state of waste economy management in the company with aim for draft to put forvard for reuse, disposal and removal to minimize the cost of waste. First part gets on with classify the type of waste management, waste divide and utilization. Next part looks into the state of waste and production in company. The last part is based on previous and it is suggested for improvement in solution of the environment.
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Interconnection Technologies for 3D Electronic and Microelectronic Constructions
Nicák, Michal ; Pietriková,, Alena (referee) ; Starý, Jiří (referee) ; Šandera, Josef (advisor)
The doctoral thesis is focused on research on application possibilities of soldered interconnection structures especially for the use with innovative 3D structures assembled using the LTCC ceramic materials, PVD deposited and galvanically modified pads, solid core solder balls. It consists of several main parts. Introduction is followed by theoretical survey of current situation and technologies. Thesis continues with introduction of main goals and with summary of successively performed experiments and their results. End of the work belongs to summary of results and gained knowledge.
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